WAFER LENS PRODUCTION METHOD - KONICA MINOLTA OPTO INC

Title:

WAFER LENS PRODUCTION METHOD

Document Type and Number:

WIPO Patent Application WO/2011/024745

Kind Code:

A1

Abstract:

The aim is to regulate thickness on the optical axis in the production of wafer lenses. Disclosed is a wafer lens production method that is equipped with a dispensing process for dropping resin onto a forming die (64), an imprinting process for pressing either the forming die (64) or a glass substrate (2) toward the other, and a releasing process for releasing the glass substrate (2) from the forming die (64), and that repeats the processing from the dispensing process to the releasing process as a single cycle and successively forms resin lenses (4) on the glass substrate (2); wherein the height (A) of the non-lens area (6) surrounding the lenses (4) and the height (B, C) of the glass substrate (2) are measured between the releasing process of a first cycle and the dispensing process of a second cycle, and the position of the forming die (64) is corrected for the imprinting processes of the second cycle on, on the basis of the heights (A-C).

Inventors:

FUJII YUITI (JP)
FUJIMOTO AKIHIRO (JP)
TAKITANI TOSHIYA (JP)
HOSOE SHIGERU (JP)

Application Number:

PCT/JP2010/064157

Publication Date:

March 03, 2011

Filing Date:

August 23, 2010

Export Citation:

Click for automatic bibliography generation Help

Assignee:

KONICA MINOLTA OPTO INC (JP)
FUJII YUITI (JP)
FUJIMOTO AKIHIRO (JP)
TAKITANI TOSHIYA (JP)
HOSOE SHIGERU (JP)

International Classes:

B29C39/06; B29C39/10; B29C39/44; G02B3/00; B29L11/00

Foreign References:

JP2009018578A	2009-01-29
JP2003033926A	2003-02-04
JP2007137051A	2007-06-07
JP2008279772A	2008-11-20
JP2010080632A	2010-04-08
JP3926380B1	2007-06-06
US20060259546A1	2006-11-16

Other References: