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Patent Searching and Data


Title:
WAFER LENS PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2012/063882
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a wafer lens production method capable of simply and precisely molding an optical surface while preventing damage to a substrate caused by mold release, when molding a lens surface or other optical surface on both surfaces of the substrate. A second molding surface (103a) is released from a second metal mold (42) before a first molding surface (102a) is completely released from a first metal mold (41) and, as a result, a releasing force is applied at the same time to both the first and second molding surfaces (102a, 103a) of the substrate (101) in a state such that an uneven force could not be readily applied, enabling the prevention of damage to the substrate (101) at mold release even for comparatively thin substrates (101). In addition, the mold release occurs with the sections of the first and second molding surfaces (102a, 103a) that have not been released remaining in each, thereby enabling the simple and efficient production of a precise wafer lens (100) without requiring the provision of a separate step for protecting first and second optical surfaces (11d, 12d) on the opposite side at mold release.

Inventors:
EGURO KOUICHI (JP)
SARUYA NOBUHIRO (JP)
Application Number:
PCT/JP2011/075869
Publication Date:
May 18, 2012
Filing Date:
November 09, 2011
Export Citation:
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Assignee:
KONICA MINOLTA OPTO INC (JP)
EGURO KOUICHI (JP)
SARUYA NOBUHIRO (JP)
International Classes:
B29C39/24; G02B3/00; B29L11/00
Foreign References:
JP2010204631A2010-09-16
JP2009251368A2009-10-29
JP2011062926A2011-03-31
JP2010072665A2010-04-02
JP2009226638A2009-10-08
Other References:
See also references of EP 2639033A4
Attorney, Agent or Firm:
FUKUDA, MITSUHIRO (JP)
Mitsuhiro Fukuda (JP)
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Claims: