Title:
WAFER MANUFACTURING METHOD AND WAFER
Document Type and Number:
WIPO Patent Application WO/2018/079105
Kind Code:
A1
Abstract:
A resin layer forming process for forming a resin layer (RH) on one surface (W1) of a wafer (W) includes: a holding step for holding, through suction, the other surface (W2) of the wafer (W) by a holding means; a flat surface forming step for sandwiching a curable resin having a viscosity not greater than 1000 mPa·s between the flat part of a flat plate and one surface (W1) of the wafer (W) so as to form a pre-cured flat surface conforming to the flat part on the curable resin; a hold releasing step for releasing the holding, through suction, of the other surface (W2); a curing step for forming the resin layer (RH) by curing the curable resin; and a separation step for separating the flat part from the resin layer (RH).
Inventors:
TANAKA TOSHIYUKI (JP)
MATAGAWA SATOSHI (JP)
NAKASHIMA AKIRA (JP)
MATAGAWA SATOSHI (JP)
NAKASHIMA AKIRA (JP)
Application Number:
PCT/JP2017/032814
Publication Date:
May 03, 2018
Filing Date:
September 12, 2017
Export Citation:
Assignee:
SUMCO CORP (JP)
International Classes:
H01L21/304; B24B7/22
Foreign References:
| JP2010155298A | 2010-07-15 | |||
| JPH11111653A | 1999-04-23 | |||
| JP2002134581A | 2002-05-10 |
Attorney, Agent or Firm:
KINOSHITA & ASSOCIATES (JP)
Download PDF: