Title:
WAFER MANUFACTURING METHOD AND WAFER
Document Type and Number:
WIPO Patent Application WO/2018/079222
Kind Code:
A1
Abstract:
This wafer manufacturing method includes: a chamfering step for chamfering a wrapped wafer or a wafer cut out from a single crystal ingot; a resin layer forming step for forming a resin layer by applying a curable resin on one surface of the chamfered wafer; a first flat surface grinding step for grinding flat the other surface of the wafer by holding said one surface via the resin layer; a resin layer removing step for removing the resin layer; and a second flat surface grinding step for grinding flat said one surface by holding the other surface, wherein, in the resin layer forming step, the curable resin is applied so as to satisfy formula (1): Ra×V≥2×103, where Ra (nm) represents arithmetic average roughness of the chamfered part of the wafer, and V (mPa·s) represents viscosity of the curable resin when being applied.
Inventors:
TANAKA TOSHIYUKI (JP)
MATAGAWA SATOSHI (JP)
MATAGAWA SATOSHI (JP)
Application Number:
PCT/JP2017/036313
Publication Date:
May 03, 2018
Filing Date:
October 05, 2017
Export Citation:
Assignee:
SUMCO CORP (JP)
International Classes:
H01L21/304; B24B7/04
Domestic Patent References:
| WO2014129304A1 | 2014-08-28 |
Foreign References:
| JP2015008247A | 2015-01-15 | |||
| JP2009272557A | 2009-11-19 | |||
| JP2015038919A | 2015-02-26 | |||
| JP2010155298A | 2010-07-15 | |||
| JP2009302409A | 2009-12-24 |
Attorney, Agent or Firm:
KINOSHITA & ASSOCIATES (JP)
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