Title:
WAFER MANUFACTURING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2021/117351
Kind Code:
A1
Abstract:
[Problem] To provide a wafer manufacturing system that enables: collection, in a short sampling period, of analog output signals of a variety of sensors measuring physical quantities during processing of a wafer by a wafer manufacturing device; and storage of tracking information of the wafer being processed, such tracking being in association with the output signals of the various sensors. [Solution] A wafer manufacturing system 1 comprises: a wafer manufacturing device 10 provided with sensors 11; a host PC that is connected to the wafer manufacturing device 10 via a data communication line 12; a logic controller 16 that samples and stores analog output signals of the sensors 11; and a relay PC 17 that extracts tracking information, flowing over the data communication line 12, of a wafer or a single crystal being processed by the wafer manufacturing device 10 and sends same to the logic controller 16. The logic controller 16 stores digital values of analog output signals of the sensors 11 in association with the tracking information that has been sent from the relay PC 17.
Inventors:
DAIGO SHIGERU (JP)
Application Number:
PCT/JP2020/039528
Publication Date:
June 17, 2021
Filing Date:
October 21, 2020
Export Citation:
Assignee:
SUMCO CORP (JP)
International Classes:
H01L21/02
Foreign References:
| JP2009064798A | 2009-03-26 | |||
| JP2006093641A | 2006-04-06 | |||
| JP2004025057A | 2004-01-29 | |||
| JP2006093446A | 2006-04-06 |
Attorney, Agent or Firm:
WASHIZU Mitsuhiro et al. (JP)
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