Title:
WAFER POLISHING METHOD AND POLISHING DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/205740
Kind Code:
A1
Abstract:
The present invention is a wafer polishing method, for performing corrective polishing by pressing a wafer onto a polishing cloth while continuously supplying a water-containing polishing composition in order to correct the shape of a polished wafer that has been polished, the method being characterized by comprising: a step in which the shape of the polished wafer is measured before the corrective polishing is performed; a step in which a type of surfactant to be included in the polishing composition, and the concentration thereof, are determined in accordance with the measured shape of the polished wafer; and a step in which the corrective polishing is performed while the polishing composition, adjusted on the basis of the determined type and concentration of the surfactant, is supplied. Due to this configuration, a wafer polishing method and a polishing device are provided, with which variations in the shape of the wafer that were generated in an earlier polishing step can be reduced in a later polishing step.
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Inventors:
OSEKI MASAAKI (JP)
ABE TATSUO (JP)
SATO MICHITO (JP)
ABE TATSUO (JP)
SATO MICHITO (JP)
Application Number:
PCT/JP2021/004538
Publication Date:
October 14, 2021
Filing Date:
February 08, 2021
Export Citation:
Assignee:
SHINETSU HANDOTAI KK (JP)
International Classes:
B24B1/00; B24B37/00; B24B49/04; H01L21/304
Foreign References:
| JP2005347453A | 2005-12-15 | |||
| JP2019145750A | 2019-08-29 | |||
| CN103231304A | 2013-08-07 | |||
| JP2003100668A | 2003-04-04 | |||
| JP2008205147A | 2008-09-04 |
Attorney, Agent or Firm:
YOSHIMIYA Mikio et al. (JP)
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