Title:
WAFER PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2019/163017
Kind Code:
A1
Abstract:
This wafer production method comprises a first resin pasting and grinding step, a second resin pasting and grinding step, and a third flat-grinding step. The first resin pasting and grinding step comprises: a first coating layer forming step of forming a first coating layer over the entirety of a second surface of a wafer; a first flat-grinding step of placing the wafer in such a manner that the first coating layer abuts a reference surface of a table and flat-grinding a first surface of the wafer; and a first coating layer removal step of removing the first coating layer. The second resin pasting and grinding step comprises: a second coating layer forming step of forming a second coating layer over the entirety of the first surface; a second flat-grinding step of placing the wafer in such a manner that the second coating layer abuts the reference surface of the table and flat-grinding the second surface; and a second coating layer removal step of removing the second coating layer. The third flat-grinding step comprises placing the wafer in such a manner that the surface that has been flat-ground last abuts the reference surface of the table and flat-grinding the surface of the wafer on the side facing away from the surface abutting the reference surface.
Inventors:
TANAKA TOSHIYUKI (JP)
Application Number:
PCT/JP2018/006188
Publication Date:
August 29, 2019
Filing Date:
February 21, 2018
Export Citation:
Assignee:
SUMCO CORP (JP)
International Classes:
H01L21/304; B24B7/04; B24B27/06
Domestic Patent References:
| WO2017134925A1 | 2017-08-10 |
Foreign References:
| JP2006269761A | 2006-10-05 | |||
| JP2014011378A | 2014-01-20 | |||
| JP2015008247A | 2015-01-15 |
Attorney, Agent or Firm:
KINOSHITA & ASSOCIATES (JP)
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