Title:
WAFER, SMART PROCESSOR, AND ELECTRICAL DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/093265
Kind Code:
A1
Abstract:
Provided are a wafer (10), a smart processor, and an electrical device; the wafer (10) has a first power supply region (101) and a second power supply region (102) arranged at intervals; the first power supply region (101) comprises a first solder pad (1011) and a second solder pad (1012); the second power supply region (102) comprises a second solder pad (1021) and a third solder pad (1022); the first solder pad (1011) in the first power supply region (101) is used as a power input terminal; the second solder pad (1012) in the first power supply region (101) is connected to the second solder pad (1021) in the second power supply region (102); the third solder pad (1022) in the second power supply region (102) is used as a ground terminal of the second power supply region (102); it is necessary only to use the first solder pad (1011) in the first power supply region (101) as a power input terminal and use the third solder pad (1022) in the second power supply region (102) as a ground terminal to supply power to the wafer (10); the arrangement described above reduces the number of solder pads connected to solder balls on a substrate (20), thus decreasing the number of solder balls on the substrate (20), simplifying the structure of the substrate and reducing production cost.
Inventors:
YANG SHUAI (CN)
GUO HAN (CN)
GUO HAN (CN)
Application Number:
PCT/CN2018/114351
Publication Date:
May 14, 2020
Filing Date:
November 07, 2018
Export Citation:
Assignee:
BITMAIN TECH INC (CN)
International Classes:
H01L23/488
Domestic Patent References:
| WO2017203607A1 | 2017-11-30 |
Foreign References:
| US8659144B1 | 2014-02-25 | |||
| CN102891146A | 2013-01-23 | |||
| CN1754259A | 2006-03-29 |
Attorney, Agent or Firm:
LEADER PATENT & TRADEMARK FIRM (CN)
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