Title:
WAFER SUPPORTING PLATFORM, AND RF ROD
Document Type and Number:
WIPO Patent Application WO/2022/209619
Kind Code:
A1
Abstract:
A wafer supporting platform 20 is provided with: a ceramic substrate 21 which has a wafer placement surface 21a and in which an RF electrode 22 and a heater electrode 27 are embedded in this order from the wafer placement surface 21a side; a hole 21c provided directed toward the RF electrode 22 from a surface of the ceramic substrate 21 on the opposite side to the wafer placement surface 21a; and an RF rod 30 which supplies high-frequency electric power to the RF electrode 22, and of which a tip end 30a is joined to 23, connected to the RF electrode 22 that is exposed in a bottom surface of the hole 21c. In the RF rod 30, a region from the tip end 30a to a predetermined position 33 is formed from a first rod member 32 made from Ni, and a region from the predetermined position 33 to a base end 30b is formed from a second rod member 34 made from a non-magnetic body.
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Inventors:
UNNO YUTAKA (JP)
HARA TOMOHIRO (JP)
HARA TOMOHIRO (JP)
Application Number:
PCT/JP2022/009916
Publication Date:
October 06, 2022
Filing Date:
March 08, 2022
Export Citation:
Assignee:
NGK INSULATORS LTD (JP)
International Classes:
H05B3/02; H01L21/02; H01L21/683; H05B3/14; H05B3/16
Domestic Patent References:
| WO2016080502A1 | 2016-05-26 |
Foreign References:
| JP2017183329A | 2017-10-05 | |||
| US20200013586A1 | 2020-01-09 | |||
| US20170278682A1 | 2017-09-28 | |||
| JPH03145084A | 1991-06-20 | |||
| JP2017119593A | 2017-07-06 | |||
| JP2016143795A | 2016-08-08 |
Attorney, Agent or Firm:
ITEC INTERNATIONAL PATENT FIRM (JP)
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