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Title:
WAFER TRANSFER METHOD AND WAFER TRANSFER APPARATUS
Document Type and Number:
WIPO Patent Application WO/2010/116949
Kind Code:
A1
Abstract:
Disclosed is a wafer transfer method which is provided with a step of giving buoyancy to the topmost wafer (Wf) of a plurality of wafers (Wf) stacked in a liquid, by jetting the liquid toward above the topmost wafer, and/or a step of reliably separating the topmost wafer by jetting the liquid toward the end surfaces of the wafers (Wf). Thus, the semiconductor wafer can be separated one by one without a manual operation, for instance, after cutting the semiconductor wafers by means of a wire saw.

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Inventors:
MIYAI HIROTAKA (JP)
YAMAMOTO SHIGEO (JP)
SEKIME HIROSHIGE (JP)
TOMITA KOUICHI (JP)
HARA MASATAKA (JP)
Application Number:
PCT/JP2010/056056
Publication Date:
October 14, 2010
Filing Date:
April 02, 2010
Export Citation:
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Assignee:
SUMITOMO METAL FINE TECHNOLOGY (JP)
MIYAI HIROTAKA (JP)
YAMAMOTO SHIGEO (JP)
SEKIME HIROSHIGE (JP)
TOMITA KOUICHI (JP)
HARA MASATAKA (JP)
International Classes:
H01L21/677; B65G49/07
Foreign References:
JPH1059544A1998-03-03
JP2003292160A2003-10-15
JPH01139441A1989-05-31
JPH09148278A1997-06-06
JPH08250570A1996-09-27
JPS61197037U1986-12-09
JPS59190729U1984-12-18
JPH10114426A1998-05-06
JPH09237770A1997-09-09
JPH043744A1992-01-08
Attorney, Agent or Firm:
YOSHIDA Minoru et al. (JP)
Yoshida 稔 (JP)
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