Title:
WAFER WITH FIXING AGENT AND METHOD FOR PRODUCING WAFER WITH FIXING AGENT
Document Type and Number:
WIPO Patent Application WO/2006/129458
Kind Code:
A1
Abstract:
A wafer (100) with a fixing agent, having a supporting wafer (1) and the fixing agent (2) arranged on the surface of the supporting wafer (1). The wafer (100) further has an infiltration preventive structure (3) arranged at an edge section of the supporting wafer (1). The fixing agent (2) is arranged in a recess formed by the supporting wafer (1) and the infiltration preventive structure (3). When the supporting wafer (1) and a wafer to be processed are bonded and fixed, the fixing agent (2) is prevented from projecting and contaminating the work environment, and further, a liquid substance can be prevented from infiltrating between the supporting wafer (1) and the wafer to be processed.
Inventors:
HIEDA KATSUHIKO (JP)
Application Number:
PCT/JP2006/309483
Publication Date:
December 07, 2006
Filing Date:
May 11, 2006
Export Citation:
Assignee:
JSR CORP (JP)
HIEDA KATSUHIKO (JP)
HIEDA KATSUHIKO (JP)
International Classes:
H01L21/683; B05C11/08; H01L21/02; H01L21/301; H01L21/304
Foreign References:
| JP2004134538A | 2004-04-30 | |||
| JPH03256668A | 1991-11-15 | |||
| JPH09129577A | 1997-05-16 |
Attorney, Agent or Firm:
Watanabe, Kazuhira (No.8 Kikuboshi Tower Building 20-18,
Asakusabashi 3-chom, Taito-ku Tokyo 53, JP)
Download PDF:
Previous Patent: AQUEOUS LUBRICATING COATING AGENT TO BE USED FOR SOLIDS
Next Patent: DIGITAL RADIATION IMAGE CAPTURING SYSTEM
Next Patent: DIGITAL RADIATION IMAGE CAPTURING SYSTEM