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Title:
WARP CORRECTION SYSTEM, AND PRODUCTION SYSTEM
Document Type and Number:
WIPO Patent Application WO/2024/042752
Kind Code:
A1
Abstract:
This warp correction system comprises a warp correction device and a relay unit. The warp correction device corrects warp in a first molded substrate and produces a second molded substrate. The relay unit is disposed between the warp correction device and a machining device on the exterior of the warp correction device. The machining device machines the second molded substrate. The relay unit includes a first conveyance mechanism that receives the second molded substrate from the warp correction device and conveys the second molded substrate to the machining device.

Inventors:
HAYAKAWA ATOMO (JP)
WATANABE HAJIME (JP)
YOSHIOKA SHO (JP)
SAKAUE YUYA (JP)
HOSOMI TAKAYA (JP)
Application Number:
PCT/JP2023/008553
Publication Date:
February 29, 2024
Filing Date:
March 07, 2023
Export Citation:
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Assignee:
TOWA CORP (JP)
International Classes:
H01L21/50; H01L21/677
Foreign References:
JP2014117888A2014-06-30
JP2012045734A2012-03-08
JPH0697343A1994-04-08
JP2014192434A2014-10-06
Attorney, Agent or Firm:
FUJIWARA Satoshi et al. (JP)
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