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Title:
WATER ABSORBENT RESIN PARTICLES, ABSORBER AND ABSORBENT ARTICLE
Document Type and Number:
WIPO Patent Application WO/2020/184393
Kind Code:
A1
Abstract:
The present invention discloses water absorbent resin particles which have a degree of gel association of 15 or more as determined by the procedures (1)-(4). (1) 1.0 g of the water absorbent resin particles are arranged within a measuring cylinder that has a cylinder part and a base part, and 50 ml of pure water is poured into the measuring cylinder, thereby forming a swollen gel. (2) A cylindrical body, which has circular openings, while having a flat portion at the upper end, is prepared and is affixed such that the both ends thereof are open in the vertical direction. After 10 minutes from the pouring of the pure water, the cylinder part of the measuring cylinder is inserted into the cylindrical body such that the opening of the measuring cylinder faces downward in the vertical direction, while having the flat portion of the cylindrical body support the base part of the measuring cylinder. (3) By having the measuring cylinder freely fall, while holding the cylindrical body in the affixed state, the base part of the measuring cylinder is crashed into the flat part of the cylindrical body. (4) The procedure (3) is repeated at intervals of 10 seconds, and the number of crashes of the measuring cylinder into the cylindrical body until the time when 1 g or more of the swollen gel falls is measured as the degree of gel association.

Inventors:
NISHIDA MOE (JP)
Application Number:
PCT/JP2020/009505
Publication Date:
September 17, 2020
Filing Date:
March 05, 2020
Export Citation:
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Assignee:
SUMITOMO SEIKA CHEMICALS (JP)
International Classes:
C08F8/00; A61F13/49; A61F13/53; B01J20/26; C08F20/06
Domestic Patent References:
WO2005063825A12005-07-14
WO2012053121A12012-04-26
WO2014038324A12014-03-13
WO2012144564A12012-10-26
WO2004110328A12004-12-23
Foreign References:
JP2005334616A2005-12-08
JPH06345819A1994-12-20
JPH09510889A1997-11-04
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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