WATER-BASE PHOTOSENSITIVE RESIN COMPOSITION

Title:

WATER-BASE PHOTOSENSITIVE RESIN COMPOSITION

Document Type and Number:

WIPO Patent Application WO/1996/030452

Kind Code:

A1

Abstract:

A water-base photosensitive resin composition which has satisfactory resist properties equal or superior to those of solvent-base photosensitive resin compositions currently in commercial use and is developable with a dilute aqueous alkali solution. The composition comprises as the essential components: (a) an aqueous emulsion of a polymeric compound containing carboxyl groups; (b) a compound having a photopolymerizable ethylenically unsaturated bond; (c) a photopolymerization initiator capable of generating free radicals upon exposure to actinic light; and (d) an adhesion accelerator; the component (a) having a weight average molecular weight in the range of from 1,000 to 50,000, an acid value in the range of from more than 140 to 250 mg-KOH/g, and a glass transition temperature in the range of from 50 to 200 �C.

Inventors:

SAMUKAWA HIROSHI (JP)
HAGIWARA YOSHICHI (JP)
SAIGOU TSUYOSHI (JP)
HALLOCK JOHN SCOTT (US)
BECKNELL ALAN FREDERICK (US)

Application Number:

PCT/JP1996/000819

Publication Date:

October 03, 1996

Filing Date:

March 28, 1996

Export Citation:

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Assignee:

GRACE W R & CO (US)
SAMUKAWA HIROSHI (JP)
HAGIWARA YOSHICHI (JP)
SAIGOU TSUYOSHI (JP)
HALLOCK JOHN SCOTT (US)
BECKNELL ALAN FREDERICK (US)

International Classes:

G03F7/004; C08F2/22; C08F2/38; C08F2/48; C08F265/00; C08F265/06; C08L33/02; C08L101/00; C08L101/08; G03F7/027; G03F7/033; G03F7/085; H05K3/06; H05K3/18; (IPC1-7): C09D4/06; C08K5/00; C08K5/34; C08K5/45; C08L33/02; C08L33/06; C09D133/02; C09D133/06; G03F7/027

Foreign References:

JPH04153276A	1992-05-26
JPS509177B1	1975-04-10
JPH04304277A	1992-10-27
JPH06306109A	1994-11-01

Other References: