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Patent Searching and Data


Title:
WATERPROOF STRUCTURE AND WATERPROOF METHOD FOR WIRE CONNECTING PART
Document Type and Number:
WIPO Patent Application WO/2005/104302
Kind Code:
A1
Abstract:
A waterproof structure and a waterproof method for a wire connecting part, wherein the insulating coatings (11) of a plurality of wires (w1) and (w2) are peeled, and exposed cores (12) are connected to each other by welding, soldering, or through a crimp style terminal. A foam sheet (15) impregnated with a silicone (14) and an adhesive tape (16) are wrapped around the connecting part (13), and the silicone (14) is filled in clearances between the connected cores (12) for waterproofness.

Inventors:
OTSUKI HIROYUKI (JP)
HISAKI YOSHIHIRO (JP)
ITOU TAKEHARU (JP)
Application Number:
PCT/JP2005/003746
Publication Date:
November 03, 2005
Filing Date:
March 04, 2005
Export Citation:
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Assignee:
SUMITOMO WIRING SYSTEMS (JP)
OTSUKI HIROYUKI (JP)
HISAKI YOSHIHIRO (JP)
ITOU TAKEHARU (JP)
International Classes:
H01R4/70; H01R13/52; H01R43/00; H02G1/14; H02G15/08; H02G15/18; H01R4/18; (IPC1-7): H01R4/70; H01R43/00; H02G1/14; H02G15/08
Foreign References:
JPS5820475U1983-02-08
JPH0746744A1995-02-14
JPH045062U1992-01-17
JPH11283446A1999-10-15
JPH01206573A1989-08-18
JPH04324263A1992-11-13
JPH11297382A1999-10-29
JPH09185967A1997-07-15
JPH01248484A1989-10-04
Other References:
See also references of EP 1744403A4
Attorney, Agent or Firm:
Owada, Kazumi (6-20 Dojima 1-chome, Kita-ku, Osaka-shi Osaka, JP)
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