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Patent Searching and Data


Title:
WAVEGUIDE LAMINATE STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2018/189831
Kind Code:
A1
Abstract:
This waveguide laminate structure is configured by being provided with a first multilayer dielectric substrate, a second multilayer dielectric substrate, and a dielectric insulating film that regulates a space that is formed when the substrates are disposed facing each other. The first multilayer dielectric substrate has: a surface layer conductor having a cutout that is formed at a distance from an end section of an opening; an inner layer conductor; a conductor via; and a choke structure formed outside of the opening. The dielectric insulating film is disposed further toward the outside than the choke structure.

Inventors:
TABATA TETSURO (JP)
HATATE TSUYOSHI (JP)
Application Number:
PCT/JP2017/014993
Publication Date:
October 18, 2018
Filing Date:
April 12, 2017
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01P1/04
Foreign References:
JP2012238948A2012-12-06
JPH0845659A1996-02-16
Attorney, Agent or Firm:
SOGA, Michiharu et al. (JP)
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