WAX AND METHOD FOR PRODUCING SAME

WIPO Patent Application WO/2011/136354

A1

Disclosed is a wax that is added to a thermoplastic resin that undergoes a molding process at high temperatures. The wax does not thermally decompose when that thermoplastic resin composition undergoes the molding process. The wax also prevents mold fouling and provides superior lubricating properties and mold release properties. Also disclosed are a method for producing the wax with superior productivity, a lubricant for thermoplastic resin molding processes, and a mold release agent for thermoplastic resin molding processes. The wax contains a dehydration condensed amide wax component 99.98 - 95 wt% of which is an acid, which is formed from 2 mol of a C12-22 saturated aliphatic monocarboxylic acid by molar ratio and a mol of a C2-12 polybasic acid by molar ratio (0 ≤ a ≤ 5), and b mol of a C2-14 diamine by molar ratio (1 ≤ b ≤ 6), and 0.02 - 5 wt% of an oxidation inhibitor that has compatibility with this amide wax component.

JP6247905	Polyamide resin composition
WO/2023/044002	ANTIMICROBIAL/ANTIVIRAL CONVEYOR BELT

YAMANISHI YOSHIHIKO (JP)
KINUGAWA MASASHI (JP)
MATSUYAMA TAKANORI (JP)
NAKATSUKA NOBUAKI (JP)

PCT/JP2011/060422

November 03, 2011

April 28, 2011

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KYOEISHA CHEMICAL CO LTD (JP)
YAMANISHI YOSHIHIKO (JP)
KINUGAWA MASASHI (JP)
MATSUYAMA TAKANORI (JP)
NAKATSUKA NOBUAKI (JP)

C08L77/06; C08G69/26; C08K5/00; C10M105/68; C10M107/44; C10M137/02; C10N30/00; C10N30/06; C10N30/08; C10N40/36; C10N50/08

JP2009126880A	2009-06-11
JP2004307817A	2004-11-04
JPH06145686A	1994-05-27
JP2003313321A	2003-11-06
JPH01103654A	1989-04-20
JPH06145498A	1994-05-24
JPH06145505A	1994-05-24
JPH03153793A	1991-07-01

See also references of EP 2565234A4

KOMIYA, Yoshio et al. (JP)
Yoshio Komiya (JP)

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