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Title:
WAX NOZZLE MOISTURIZING APPARATUS FOR POLISHING DEVICE DURING POLISHING PROCESS OF SILICON WAFER
Document Type and Number:
WIPO Patent Application WO/2021/109693
Kind Code:
A1
Abstract:
A wax nozzle moisturizing apparatus for a polishing device during the polishing process of a silicon wafer. The apparatus comprises: an anti-coagulation pipeline (8) connected to an anti-coagulation liquid container and a fixing support that fixes the anti-coagulation pipeline. The anti-coagulation liquid container is used for holding anti-coagulation liquid that flows out of the anti-coagulation pipeline at the contact place (6) of the anti-coagulation pipeline and a wax nozzle of the polishing device. One end of the anti-coagulation pipeline is connected to the wax nozzle of the polishing device, and the other end is connected to an anti-coagulation liquid delivery pipeline. The fixing support comprises the following three parts: a vertical fixing base (2), a horizontal fixing support (3), and an anti-coagulation pipe fixing support (5). The wax nozzle moisturizing apparatus better achieves the goal of wax nozzle moisturizing, and ameliorates phenomena such as the solidification and clogging of the wax nozzle caused by long-term shutdown. The apparatus has good practical value for ensuring the uniformity of wax coating during the polishing process of the silicon wafer and improving the polishing yield.

Inventors:
WU HOMING (CN)
DANG GUOYANG (CN)
CHUNG EDWARD (CN)
CHEN JERRY (CN)
ZHOU JUNLEI (CN)
Application Number:
PCT/CN2020/117980
Publication Date:
June 10, 2021
Filing Date:
September 27, 2020
Export Citation:
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Assignee:
WAFER WORKS ZHENGZHOU CORP (CN)
International Classes:
B24B29/02; B24B57/02
Foreign References:
CN209600070U2019-11-08
CN211388245U2020-09-01
JP2003111966A2003-04-15
CN201728595U2011-02-02
CN101920476A2010-12-22
CN208018809U2018-10-30
JP2002001165A2002-01-08
Attorney, Agent or Firm:
SHANGHAI PATENT & TRADEMARK LAW OFFICE, LLC (CN)
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