Title:
WAX FOR TEMPORARILY BONDING MATERIAL TO BE ETCHED
Document Type and Number:
WIPO Patent Application WO/2005/063915
Kind Code:
A1
Abstract:
A wax for temporarily bonding a material to be etched is characterized by having a viscosity at 80&ring C of not less than 1.7 Pa·s, a viscosity at 100&ring C of not more than 0.50 Pa·s, and a softening point of not less than 57&ring C. This wax contains, in mass%, 40-50% of a rosin, 20-30% of an acid-modified rosin and 20-30% of a higher fatty acid. The wax is suitably used for temporarily bonding a semiconductor wafer to be etched to a supporting substrate.
Inventors:
TANAKA HIROSHI (JP)
NISHIDA HIROSHI (JP)
NISHIDA HIROSHI (JP)
Application Number:
PCT/JP2004/019343
Publication Date:
July 14, 2005
Filing Date:
December 24, 2004
Export Citation:
Assignee:
SUMITOMO PRECISION PROD CO (JP)
TANAKA HIROSHI (JP)
NISHIDA HIROSHI (JP)
TANAKA HIROSHI (JP)
NISHIDA HIROSHI (JP)
International Classes:
C09J191/06; C08L93/04; C09J5/00; C09J11/06; C09J193/04; (IPC1-7): C09J191/06; C09J5/00; C09J11/06; C09J193/04
Foreign References:
| JPH03203981A | 1991-09-05 | |||
| JPH11293224A | 1999-10-26 | |||
| JPH09157628A | 1997-06-17 | |||
| JP2000087004A | 2000-03-28 | |||
| JPS54123148A | 1979-09-25 |
Attorney, Agent or Firm:
Honoue, Terutada (Higashinaniwa-cho 5-chom, Amagasaki-shi Hyogo 92, JP)
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