Title:
WIDE-BANDWIDTH ANTENNA IN PACKAGE DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/082361
Kind Code:
A1
Abstract:
The present invention relates to the field of antennas in package. Provided is a wide-bandwidth antenna in package (AiP) device capable of realizing packaging of a wide-bandwidth antenna. The antenna in package device comprises two electrically connected substrates arranged opposite to each other. A portion of the antenna is provided in one of the two substrates, and another portion of the antenna is provided in the other substrate. The two portions of the antenna are connected by means of solder balls soldered between the two substrates. The antenna can comprise a radiator (radiating element) and a feed path for conveying an electrical current to the radiator. In the invention, an antenna extends from one substrate to another substrate, and thus has an increased effective height, thereby extending a vertically polarized current path, and increasing the gain and bandwidth of the antenna.
Inventors:
ZHANG HAIWEI (CN)
HU HAOTAO (CN)
ZHANG YAOJIANG (CN)
HU HAOTAO (CN)
ZHANG YAOJIANG (CN)
Application Number:
PCT/CN2018/112186
Publication Date:
April 30, 2020
Filing Date:
October 26, 2018
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H01Q1/36; H01Q9/30
Foreign References:
| CN1627562A | 2005-06-15 | |||
| CN103779336A | 2014-05-07 | |||
| US9711866B1 | 2017-07-18 | |||
| JP2000341026A | 2000-12-08 |
Other References:
See also references of EP 3846286A4
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