Title:
WIRE BONDING DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/077026
Kind Code:
A1
Abstract:
A wire bonding device (10) includes a capillary (28) for inserting a wire (30) thereinto and a control unit (80). The control unit (80) comprises: a cutting process for moving the capillary having the wire inserted thereinto in a horizontal plane orthogonal to the axial direction of the capillary with the wire clamped condition and cutting the wire at the second bonding point, after a second bonding process; a waste bonding process for extending the wire from the second bonding point to a prescribed waste bonding point, and carrying out the waste bonding at the waste bonding point; and a shaping process for shaping the wire projecting from the tip end of the capillary into a prescribed bending shape after the waste bonding process. The control unit (80) is configured to implement each process.
Inventors:
SEKINE NAOKI (JP)
NAKAZAWA MOTOKI (JP)
NAGASHIMA YASUO (JP)
NAKAZAWA MOTOKI (JP)
NAGASHIMA YASUO (JP)
Application Number:
PCT/JP2013/075103
Publication Date:
May 22, 2014
Filing Date:
September 18, 2013
Export Citation:
Assignee:
SHINKAWA KK (JP)
International Classes:
H01L21/60
Foreign References:
| JPS60182147A | 1985-09-17 | |||
| US20050167473A1 | 2005-08-04 | |||
| JPS5889833A | 1983-05-28 |
Attorney, Agent or Firm:
YKI Patent Attorneys (JP)
Patent business corporation YKI international patent firm (JP)
Patent business corporation YKI international patent firm (JP)
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