Title:
WIRE BONDING METHOD AND DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/149605
Kind Code:
A1
Abstract:
A wire bonding method and a wire bonding device are presented. The wire bonding method bonds a wire to form a bonding wire by using a bonding capillary which leads a wire, detects a defect occurring in a first tail of the wire, bonds the first tail of the wire to a discard lead, separates the first tail of the wire bonded to the discard lead from the wire, and guides a second tail to the separated wire. Wire bonding is performed again by using the wire to which the second tail is guided. A wire bonding device is configured to perform the wire bonding method.
Inventors:
KIM SEUNG GYU (KR)
KO HAN GIL (KR)
SON CHANG JUN (KR)
LEE KANG SUK (KR)
KO HAN GIL (KR)
SON CHANG JUN (KR)
LEE KANG SUK (KR)
Application Number:
PCT/KR2022/009383
Publication Date:
August 10, 2023
Filing Date:
June 30, 2022
Export Citation:
Assignee:
SK HYNIX INC (KR)
SHINKAWA KK (JP)
SHINKAWA KK (JP)
International Classes:
H01L23/00
Foreign References:
| KR20130045808A | 2013-05-06 | |||
| KR20070070050A | 2007-07-03 | |||
| KR20080110045A | 2008-12-18 | |||
| US20130341378A1 | 2013-12-26 | |||
| KR20050065248A | 2005-06-29 |
Attorney, Agent or Firm:
AJU INTERNATIONAL LAW & PATENT GROUP (KR)
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