Title:
WIRE-BONDING SYSTEM AND METHOD FOR COB DIE-BONDING
Document Type and Number:
WIPO Patent Application WO/2017/096640
Kind Code:
A1
Abstract:
A wire-bonding system and method for COB die-bonding. The system comprises a controller, a forward die-bonder, a reverse die-bonder, and a conveyor belt, wherein the controller is separately connected to the forward die-bonder and the reverse die-bonder, and the forward die-bonder and the reverse die-bonder are connected to each other by means of the conveyor belt. A combination of forward and reverse chip fixation is implemented by using a forward die-bonder and a reverse die-bonder, and thus minimum connection Au wires can be used for chips on a substrate, thereby reducing the circuit costs, the working time and labor. The wire-bonding system and method for COB die-bonding can be widely used in the electronics field.
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Inventors:
HE MIAO (CN)
ZHANG YUANYUAN (CN)
ZHANG YUANYUAN (CN)
Application Number:
PCT/CN2015/097990
Publication Date:
June 15, 2017
Filing Date:
December 21, 2015
Export Citation:
Assignee:
UNIV SOUTH CHINA NORMAL (CN)
International Classes:
H01L21/67; H01L21/60; H01L25/075
Foreign References:
| CN103159167A | 2013-06-19 | |||
| CN103972222A | 2014-08-06 | |||
| CN102683553A | 2012-09-19 | |||
| CN104022109A | 2014-09-03 |
Attorney, Agent or Firm:
JIAQUAN IP LAW FIRM (CN)
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