Title:
WIRE HARNESS BUNDLING DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/070997
Kind Code:
A1
Abstract:
Provided is a wire harness bundling device that can automate and increase the speed of work to bundle electric wires in a bundle body by continuously bundling a plurality of electric wires by using the bundle body, and that forms a wire harness capable of suppressing decreasing of the bundling force bundling the electric wires. The wire harness bundling device comprises: a wire supply unit that supplies wire in the vicinity of a body to be bundled; and an annulation forming part that forms an annular part by curving a portion of the wire supplied from the wire supply unit. The annulation forming part continuously forms a plurality of annular parts from the wire supplied by the wire supply unit, disposes the plurality of annular parts along the longitudinal direction of the body to be bundled, and links annular parts that are adjacent along the longitudinal direction of the body to be bundled, thereby forming a bundle body.
Inventors:
TAMAI HIROFUMI (JP)
Application Number:
PCT/JP2023/034629
Publication Date:
April 04, 2024
Filing Date:
September 25, 2023
Export Citation:
Assignee:
MUSCLE CORP (JP)
International Classes:
H01B13/012; H01B7/00; H02G1/06
Foreign References:
| JPH02114317U | 1990-09-13 | |||
| US6233796B1 | 2001-05-22 |
Attorney, Agent or Firm:
SAHARA Ryuichi (JP)
Download PDF:
Previous Patent: OPTICAL FILM, POLARIZING PLATE, SURFACE PLATE, IMAGE DISPLAY PANEL, AND IMAGE DISPLAY DEVICE USING S...
Next Patent: MEASURING DEVICE
Next Patent: MEASURING DEVICE