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Patent Searching and Data


Title:
WIRE INCLUDING TUNGSTEN
Document Type and Number:
WIPO Patent Application WO/2021/153451
Kind Code:
A1
Abstract:
This wire including tungsten comprises 50-150 ppm of at least one selected from the group consisting of potassium, cerium, lanthanum, and silicon, wherein the wire has a tungsten content of 99.92 mass% or more, a wire diameter of 5-22 µm, and a surface roughness Ra of 0.5 µm or less.

Inventors:
WATANABE SHUHEI (JP)
ITOH YASUSHI (JP)
Application Number:
PCT/JP2021/002227
Publication Date:
August 05, 2021
Filing Date:
January 22, 2021
Export Citation:
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Assignee:
ALMT CORP (JP)
International Classes:
C22C27/04; C22F1/18; B21C1/00; B22F3/02; B22F3/10; B22F3/24; B22F5/12; C22C1/04; C22F1/00; C22F1/02
Foreign References:
JP2018122599A2018-08-09
JP2018001436A2018-01-11
JP2019131841A2019-08-08
JP2018167558A2018-11-01
JP2001312952A2001-11-09
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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