Title:
WIRE MATERIAL PAYOUT DEVICE AND WIRE SOLDER
Document Type and Number:
WIPO Patent Application WO/2005/000515
Kind Code:
A1
Abstract:
A wire material payout device where a soft wire material is easily inserted and set. The wire material payout device pays out a wire material by a chuck body (7) capable of gripping and releasing the material and moving it in the forward and backward directions. Releasing means for maintaining a released state of the chuck body is disposed in the device.
Inventors:
ISHII KOU (JP)
YANAGAWA YOSHIAKI (JP)
MARUYAMA SHIGEKI (JP)
YANAGAWA YOSHIAKI (JP)
MARUYAMA SHIGEKI (JP)
Application Number:
PCT/JP2004/008877
Publication Date:
January 06, 2005
Filing Date:
June 24, 2004
Export Citation:
Assignee:
PENTEL KK (JP)
SENJU METAL INDUSTRY CO (JP)
ISHII KOU (JP)
YANAGAWA YOSHIAKI (JP)
MARUYAMA SHIGEKI (JP)
SENJU METAL INDUSTRY CO (JP)
ISHII KOU (JP)
YANAGAWA YOSHIAKI (JP)
MARUYAMA SHIGEKI (JP)
International Classes:
B23K3/06; (IPC1-7): B23K3/06
Foreign References:
| JPH0391179U | 1991-09-17 | |||
| JPH10114466A | 1998-05-06 | |||
| JPS56160660U | 1981-11-30 |
Attorney, Agent or Firm:
Shimizu, Chiharu (Nakagin-Shiroyama Bldg. 16-13, Ginza 8-chom, Chuo-ku Tokyo 61, JP)
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