Title:
WIRE MATERIAL PLATING EQUIPMENT
Document Type and Number:
WIPO Patent Application WO/2003/060176
Kind Code:
A1
Abstract:
A wire material plating equipment capable of stably manufacturing, with a high productivity, plated wire material having uniform plating layer with a nonuniform thickness ratio of 2.0 or less by properly cooling the area of the plating layer where nonuniform wall thickness is liable to occur due to large fluidity at a high temperature immediately after plating and the area of the plating area where nonuniform wall thickness is hard to occur due to low fluidity at a low temperature, wherein wire material rising from a plating bath surface through a plating drawing part is cooled at least by an air cooling device having a pressurized air part, a lower side cooling part on the lower side of the pressurized air part, and an upper side cooling part on the upper side of the pressurized air part, and the wire material passing the air cooling device is air−cooled in two steps by main cooling air flowing into the upper side cooling part from the air jetting port of the pressurized air part and flowing out of an outlet at the upper end of the upper side cooling part and an auxiliary cooling air sucked by the flow of the main cooling air, flowing into the lower side cooling part from an inlet at the lower end of the lower side cooling part and merging to the main cooling air.
Inventors:
KITSUWA TOMIO (JP)
Application Number:
PCT/JP2002/008397
Publication Date:
July 24, 2003
Filing Date:
August 21, 2002
Export Citation:
Assignee:
SAKURATECH CO LTD (JP)
KITSUWA TOMIO (JP)
KITSUWA TOMIO (JP)
International Classes:
C23C2/18; C23C2/20; C23C2/26; C23C2/38; (IPC1-7): C23C2/00; C23C2/38
Foreign References:
| JP2000045056A | 2000-02-15 | |||
| JPH1060615A | 1998-03-03 | |||
| JPH04183844A | 1992-06-30 |
Attorney, Agent or Firm:
Hosoi, Sadayuki (14-7 Hakusan 5-chom, Bunkyo-ku Tokyo, JP)
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