Title:
WIRELESS COMMUNICATION MODULE
Document Type and Number:
WIPO Patent Application WO/2016/063759
Kind Code:
A1
Abstract:
Disclosed is a wireless communication module wherein a grounding layer is disposed in a dielectric substrate. An antenna pattern that operates as an antenna is disposed further toward the first surface side of the dielectric substrate than the grounding layer. A high frequency element that supplies high frequency signals to the antenna pattern is mounted on a second surface of the dielectric substrate, said second surface being on the reverse side of the first surface. A plurality of signal conductor columns and a plurality of grounding conductor columns are protruding from the second surface, said signal conductor columns and grounding conductor columns being formed of conductive material. The signal conductor columns are connected to the high frequency element by means of a wiring pattern that is provided on the dielectric substrate, and the grounding conductor columns are connected to the grounding layer. Leading ends of the signal conductor columns and the grounding conductor columns are electrically connected to terminals of a mounting substrate. The wireless communication module, wherein the high frequency element can be effectively shielded, and the antenna pattern that operates as the antenna, and the grounding conductor can be disposed in multiple layers, is provided.
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Inventors:
MIZUMUMA RYUKEN (JP)
SUDO KAORU (JP)
SUDO KAORU (JP)
Application Number:
PCT/JP2015/078920
Publication Date:
April 28, 2016
Filing Date:
October 13, 2015
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01Q23/00; H01Q1/38; H01Q1/52; H01Q9/16; H01Q13/08
Domestic Patent References:
| WO2007049376A1 | 2007-05-03 |
Foreign References:
| JP2006067375A | 2006-03-09 |
Other References:
See also references of EP 3185361A4
Attorney, Agent or Firm:
KITAYAMA, Mikio et al. (JP)
Mikio Kiyama (JP)
Mikio Kiyama (JP)
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