Title:
WIRELESS COMMUNICATIONS DEVICE, PRODUCTION METHOD THEREFOR, AND RESIN MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2017/141597
Kind Code:
A1
Abstract:
A production method for a wireless communications device, including: a step in which a printed wiring board is prepared that comprises an RFIC element mounted on one main surface and an interlayer conductor extending from the one main surface to the other main surface and being connected to the RFIC element; a step in which the printed wiring board is embedded in an element body such that the interlayer conductor in the printed wiring board has an exposed section exposed towards a second main surface of the element body, said element body having a first main surface and the second main surface that are mutually facing and have a larger area than the one main surface and the other main surface of the printed wiring board; a step in which a plurality of through-holes extending from the first main surface to the second main surface of the element body are formed and a first through conductor and a second through conductor are formed in the plurality of through-holes; and a step in which a first conductor pattern, connecting one end of the first through conductor and one end of the second through conductor, is formed on the first main surface of the element body, a second conductor pattern, connecting the other end of the first through conductor, the other end of the second through conductor, and the exposed section of the interlayer conductor in the printed wiring board, is formed on the second main surface, and a coil antenna connected to the RFIC element is formed that includes the first conductor pattern, the first through conductor, the second conductor pattern, and the second through conductor.
Inventors:
KATO NOBORU (JP)
Application Number:
PCT/JP2017/001151
Publication Date:
August 24, 2017
Filing Date:
January 16, 2017
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01P11/00; G06K19/077; H01Q1/40; H01Q7/00
Domestic Patent References:
| WO2008133018A1 | 2008-11-06 | |||
| WO2009145218A1 | 2009-12-03 |
Foreign References:
| JP2009099752A | 2009-05-07 | |||
| JP2006227788A | 2006-08-31 | |||
| JP5930137B1 | 2016-06-08 | |||
| JP6008069B1 | 2016-10-19 |
Attorney, Agent or Firm:
SAMEJIMA, Mutsumi et al. (JP)
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