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Title:
WIRELESS COMMUNICATIONS DEVICE, PRODUCTION METHOD THEREFOR, AND RESIN MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2017/141771
Kind Code:
A1
Abstract:
A production method for wireless communications devices having printed wiring boards having an RFIC element mounted therein, an element body having the printed wiring boards embedded therein, and a coil antenna connected to the RFIC elements and wound around the element body. The production method includes : a step in which two printed wiring boards are prepared that each comprise an RFIC element mounted to one main surface thereof and an interlayer conductor extending from the one main surface to the other main surface and connected to the RFIC element; a step in which the printed wiring boards are separated from each other and arranged in two adjacent discrete areas; a step in which the two printed wiring boards are embedded in the element body, so as to have a first main surface and a second main surface that face each other and so as to include an exposed section in the interlayer conductor in each printed wiring board, exposed towards the second main surface; a step in which a plurality of columnar through conductors are formed that comprise a conductive material and reach across the boundary between the two discrete areas, from the first main surface of the element body to the second main surface; a step in which a first conductor pattern is formed on the first main surface of the element body and a second conductor pattern is formed on the second main surface, said first conductor pattern connecting one end of the plurality of columnar through conductors and said second conductor pattern connecting the other end of the plurality of columnar through conductors and the exposed section of the interlayer conductor in each printed wiring board; and a step in which the plurality of columnar through conductors, the first and second conductor patterns, and the element body are split in each discrete area, and a wireless communications device is formed that includes a coil antenna connected to the RFIC elements and including, in each of the split discrete areas, an RFIC element, the split first conductor pattern, the split columnar through conductor, and the split second conductor pattern.

Inventors:
KATO NOBORU (JP)
Application Number:
PCT/JP2017/004419
Publication Date:
August 24, 2017
Filing Date:
February 07, 2017
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01Q7/00; G06K19/077; H01P11/00; H01Q1/38; H05K3/28
Domestic Patent References:
WO2009145218A12009-12-03
WO2008133018A12008-11-06
Foreign References:
JP2013222264A2013-10-28
JP2001005940A2001-01-12
JP2009099752A2009-05-07
JP2006227788A2006-08-31
JP5958679B12016-08-02
JP5930137B12016-06-08
JP6008069B12016-10-19
Attorney, Agent or Firm:
SAMEJIMA, Mutsumi et al. (JP)
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