WIRELESS IC DEVICE AND METHOD FOR MANUFACTURING SAME

Title:

WIRELESS IC DEVICE AND METHOD FOR MANUFACTURING SAME

Document Type and Number:

WIPO Patent Application WO/2010/021217

Kind Code:

A1

Abstract:

Provided is a wireless IC device which functions as a noncontact RFID system even when the device is attached to an article containing metal, water, salt and the like, without hindering size and thickness reduction. A method for manufacturing such wireless IC device is also provided. The wireless IC device is composed of: a wireless IC chip (10) which processes prescribed wireless signals; a power feeding circuit board (20) having the wireless IC chip (10) mounted thereon; a loop-like electrode (30) connected to the wireless IC chip (10) with the power feeding circuit board (20) therebetween; and a first electrode plate (50) and a second electrode plate (60) connected to the loop-like electrode (30). The loop-like electrode (30) is sandwiched between the first electrode plate (50) and the second electrode plate (60), and the loop surface of the loop-like electrode is arranged perpendicularly to or to tilt from the first and the second electrode plates (50, 60). At least the first electrode plate (50) out of the first electrode plate (50) and the second electrode plate (60) is used for transmission and reception of the wireless signals.

Inventors:

KATO NOBORU (JP)

Application Number:

PCT/JP2009/062801

Publication Date:

February 25, 2010

Filing Date:

July 15, 2009

Export Citation:

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Assignee:

MURATA MANUFACTURING CO (JP)
KATO NOBORU (JP)

International Classes:

H01Q1/50; G06K19/07; G06K19/077; H01Q7/00

Domestic Patent References:

WO2006114821A1	2006-11-02
WO2007102360A1	2007-09-13

Foreign References:

JP2008148345A	2008-06-26
JP2004304370A	2004-10-28
JP2005340759A	2005-12-08
JP2006013976A	2006-01-12
JP2007172369A	2007-07-05
JP2007172527A	2007-07-05

Other References: