Title:
WIRELESS IC DEVICE AND METHOD FOR MANUFACTURING WIRELESS IC DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/145505
Kind Code:
A1
Abstract:
This wireless IC device (101) is provided with a resin main body (10) having a first surface (VS1), a helical coil and an RFIC (4) which is connected to the helical coil. The helical coil comprises a large-diameter loop and a small-diameter loop. The large-diameter loop is configured of: a first large-diameter columnar conductor (31) or the like and a second large-diameter columnar conductor (41) or the like, which are embedded in the resin main body (10); and first large-diameter conductor patterns (Bp11, Bp12) or the like, which are formed on the first surface (VS1). The small-diameter loop is configured of: a first small-diameter columnar conductor (14) or the like and a second small-diameter columnar conductor or the like, which are embedded in the resin main body (10); and first small-diameter conductor patterns (Sp13, Sp14) or the like, which are formed on the first surface (VS1). A first insulating layer (1) is sandwiched in at least portions where the first large-diameter conductor patterns (Bp11, Bp12) or the like and the first small-diameter conductor patterns (Sp13, Sp14) or the like overlap each other.
Inventors:
KATO NOBORU (JP)
Application Number:
PCT/JP2016/087703
Publication Date:
August 31, 2017
Filing Date:
December 19, 2016
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01Q1/40; G06K19/077; H01P11/00; H01Q1/24; H01Q7/00
Domestic Patent References:
| WO2015146736A1 | 2015-10-01 |
Foreign References:
| JP2013172241A | 2013-09-02 | |||
| JP2009099752A | 2009-05-07 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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