Title:
WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
Document Type and Number:
WIPO Patent Application WO/2015/163354
Kind Code:
A1
Abstract:
A wiring board (1) of the present invention is provided with: an insulating base body (11) having a main surface and side surfaces; a square cutout (12) opened in the main surface and a side surface; an electrode (13) that is provided on an inner surface of the cutout (12); and a wiring conductor (14), which is provided inside or on the surface of the insulating base body (11), and which is connected to the electrode (13). A side wall (12a) of the cutout (11) has a protruding section (12b) that is bent in a shape protruding toward the outer side of the side surface, said protruding section being formed in a center region in the direction along the side surface.
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Inventors:
UEKI NOBUHIRO (JP)
UMINO HIDEHISA (JP)
MORIYAMA YOUSUKE (JP)
UMINO HIDEHISA (JP)
MORIYAMA YOUSUKE (JP)
Application Number:
PCT/JP2015/062208
Publication Date:
October 29, 2015
Filing Date:
April 22, 2015
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01L23/13; H01L23/12; H05K1/11
Domestic Patent References:
| WO2013180247A1 | 2013-12-05 |
Foreign References:
| JP2004247627A | 2004-09-02 | |||
| JP2012174713A | 2012-09-10 |
Other References:
See also references of EP 3136430A4
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