Title:
WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
Document Type and Number:
WIPO Patent Application WO/2019/146699
Kind Code:
A1
Abstract:
This wiring board is provided with an insulating substrate, an external electrode positioned on a first surface of the insulating substrate, and wiring positioned inside the insulating substrate and electrically connected to the external electrode, wherein the wiring includes a section in which the extension direction of the wiring is inclined relative to a first surface of the insulating substrate.
Inventors:
KISAKI TAKUO (JP)
SAWADA KEISUKE (JP)
SAWADA KEISUKE (JP)
Application Number:
PCT/JP2019/002272
Publication Date:
August 01, 2019
Filing Date:
January 24, 2019
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01L23/04; H01L23/12; H03B5/32; H03H9/02; H05K3/34
Foreign References:
| JP2001196488A | 2001-07-19 | |||
| JP2004179198A | 2004-06-24 |
Attorney, Agent or Firm:
ARAFUNE, Hiroshi et al. (JP)
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