Title:
WIRING BOARD AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2023/074661
Kind Code:
A1
Abstract:
A wiring board according to the present disclosure comprises: an insulating layer; a groove located in an upper surface of the insulating layer; a recess located in the upper surface of the insulating layer and having a width greater than that of the groove; an underlying metal layer located on an inner surface of the groove and on an inner surface of the recess; a first wiring conductor located on the underlying metal layer and filling the groove; and a second wiring conductor located on the underlying metal layer and filling the recess, the second wiring conductor having a width greater than that of the first wiring conductor. The second wiring conductor includes a first portion and a second portion integrally located adjacent to the first portion. A plurality of gaps are located at a boundary between the first portion and the second portion.
Inventors:
SHIMIZU NORIYUKI (JP)
Application Number:
PCT/JP2022/039641
Publication Date:
May 04, 2023
Filing Date:
October 25, 2022
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H05K3/18
Foreign References:
| JP2001060589A | 2001-03-06 |
Attorney, Agent or Firm:
BUNA PATENT ATTORNEYS (JP)
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