Title:
WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2021/206177
Kind Code:
A1
Abstract:
This wiring board (10) comprises a board (11) and a mesh wiring layer (20) that is disposed on the board (11) and includes a plurality of wirings (21, 22). The board (11) has a transmittance of 85% or more of light rays having a wavelength of 380 nm to 750 nm. The wirings (21, 22) each have a metal layer (27) and a blackening treatment layer (28) located on the metal layer (27). The thickness (T2) of the blackening treatment layer (28) is 5 nm to 100 nm.
Inventors:
TAKE SEIJI (JP)
KAWAGUCHI SHUJI (JP)
HATSUTA CHIAKI (JP)
KAWAGUCHI SHUJI (JP)
HATSUTA CHIAKI (JP)
Application Number:
PCT/JP2021/015094
Publication Date:
October 14, 2021
Filing Date:
April 09, 2021
Export Citation:
Assignee:
DAINIPPON PRINTING CO LTD (JP)
International Classes:
H01P11/00; H01Q1/38; H05K1/02
Domestic Patent References:
| WO2019065782A1 | 2019-04-04 | |||
| WO2018193940A1 | 2018-10-25 | |||
| WO2016185942A1 | 2016-11-24 |
Foreign References:
| JP2015082178A | 2015-04-27 | |||
| JP2011066610A | 2011-03-31 | |||
| JP5636735B2 | 2014-12-10 | |||
| JP5695947B2 | 2015-04-08 |
Attorney, Agent or Firm:
NAKAMURA Yukitaka et al. (JP)
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