Title:
WIRING BOARD AND MOUNTING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/210526
Kind Code:
A1
Abstract:
A wiring board according to this disclosure includes a layered structure in which a plurality of insulating layers and a plurality of conductive layers are alternately layered. The plurality of conductive layers include a first signal wiring. The first signal wiring includes: first and second electrodes; a projecting section; a linear conductor having first and second ends; a third electrode; and first, second, and third via hole conductors. The first and third electrodes are connected to each other by a first wiring pattern including the first via hole conductor. The projecting section and the first end of the linear conductor are connected to each other by the second via hole conductor. The second end of the linear conductor and the second electrode are connected to each other by the third via hole conductor.
Inventors:
KAWASE AKI (JP)
SHIROSHITA MAKOTO (JP)
SHIROSHITA MAKOTO (JP)
Application Number:
PCT/JP2023/015908
Publication Date:
November 02, 2023
Filing Date:
April 21, 2023
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H05K1/02; H01L23/12
Domestic Patent References:
| WO2019082987A1 | 2019-05-02 |
Foreign References:
| JP2012160560A | 2012-08-23 | |||
| US6133134A | 2000-10-17 | |||
| KR20180000654A | 2018-01-03 | |||
| JP2019114675A | 2019-07-11 | |||
| JP2001264384A | 2001-09-26 | |||
| JP2011095191A | 2011-05-12 | |||
| JP2010093155A | 2010-04-22 |
Attorney, Agent or Firm:
BUNA PATENT ATTORNEYS (JP)
Download PDF: