Title:
WIRING BOARD AND PACKAGE STRUCTURE USING SAME
Document Type and Number:
WIPO Patent Application WO/2024/004992
Kind Code:
A1
Abstract:
A wiring board according to the present disclosure comprises a first insulating layer that has a first surface and a conductor layer that is arranged on the first surface. The first insulating layer comprises an insulating resin and a plurality of insulating particles that are dispersed in the insulating resin. The plurality of insulating particles include first insulating particles, each of which has a first region that is exposed from the insulating resin in the first surface when the first surface is viewed from above, and a second region other than the first region. The conductor layer is arranged on the surface of the first region and on the surface of the insulating resin, but is not arranged below the first region nor between the second region and the insulating resin.
Inventors:
YUGAWA HIDETOSHI (JP)
Application Number:
PCT/JP2023/023741
Publication Date:
January 04, 2024
Filing Date:
June 27, 2023
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H05K3/38; H05K1/03
Domestic Patent References:
| WO2020188923A1 | 2020-09-24 | |||
| WO2020067299A1 | 2020-04-02 |
Foreign References:
| JP2002190671A | 2002-07-05 | |||
| JP2003094560A | 2003-04-03 |
Attorney, Agent or Firm:
BUNA PATENT ATTORNEYS (JP)
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