Title:
WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2010/052942
Kind Code:
A1
Abstract:
A wiring board (1) with a built-in electronic component is provided with a conductor pattern layer (40); a connecting terminal (80), which is arranged on the conductor pattern layer (40) and is electrically connected to a flip-chip mounted electronic component (2); and a solder resist layer (112) formed on the conductor pattern layer (40). The solder resist layer (112) is formed at the periphery of the connecting terminal (80) on the conductor pattern layer (40), and is not formed at least on some other regions on the conductor pattern layer (40). Thus, the connecting terminal (80) is protected, and insulation between the conductors is ensured. Furthermore, since the solder resist layer (112) is not formed entirely on the conductor pattern layer (40), warpage of the substrate can be reduced.
Inventors:
FURUTANI TOSHIKI (JP)
FURUSAWA TAKESHI (JP)
FURUSAWA TAKESHI (JP)
Application Number:
PCT/JP2009/054585
Publication Date:
May 14, 2010
Filing Date:
March 10, 2009
Export Citation:
Assignee:
IBIDEN CO LTD (JP)
International Classes:
H05K3/46
Domestic Patent References:
| WO2007034629A1 | 2007-03-29 |
Foreign References:
| JP2002261449A | 2002-09-13 | |||
| JPS58148434A | 1983-09-03 | |||
| JP2002290051A | 2002-10-04 | |||
| JP2006310421A | 2006-11-09 | |||
| JP2007214230A | 2007-08-23 | |||
| JP2002237682A | 2002-08-23 | |||
| JPH08242064A | 1996-09-17 |
Attorney, Agent or Firm:
KIMURA, MITSURU (JP)
Mitsuru Kimura (JP)
Mitsuru Kimura (JP)
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