WIRING BOARD - KYOCERA CORP

Title:

WIRING BOARD

Document Type and Number:

WIPO Patent Application WO/2021/153016

Kind Code:

A1

Abstract:

The wiring board according to the present invention comprises a core insulating layer, a first stack that is positioned on the top surface of the core insulating layer, and a second stack that is positioned on the bottom surface of the core insulating layer. The first stack and the second stack each has a structure in which at least four conductor layers and at least three build-up insulating layers are positioned alternately. The first stack includes a first mounting region for mounting an electronic component. The conductor layers include two types, i.e. a first conductor layer and a second conductor layer. Of the conductor layers in the first stack, at least a first outermost layer and a first innermost layer are the first conductor layers, and first intermediate layers positioned further away from the core insulating layer than the first innermost layer are at least two or more second conductor layers.

Inventors:

KAWASE AKI (JP)
SHIROSHITA MAKOTO (JP)

Application Number:

PCT/JP2020/045635

Publication Date:

August 05, 2021

Filing Date:

December 08, 2020

Export Citation:

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Assignee:

KYOCERA CORP (JP)

International Classes:

H01L23/12; H05K1/02; H05K1/03; H05K3/46

Domestic Patent References:

WO2011018938A1

2011-02-17

Foreign References:

US9549467B1	2017-01-17
JP2016127191A	2016-07-11
US20140204546A1	2014-07-24
JP2005116811A	2005-04-28
US20050225955A1	2005-10-13
JP2004235629A	2004-08-19
JP2003110046A	2003-04-11
JP2010153520A	2010-07-08

Other References: