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Patent Searching and Data


Title:
WIRING BODY, WIRING SUBSTRATE, WIRING STRUCTURE, AND TOUCH SENSOR
Document Type and Number:
WIPO Patent Application WO/2016/136964
Kind Code:
A1
Abstract:
A wiring body (3) comprising: an adhesive layer (31); a first conductive layer (32) having first terminal sections (324T) and being provided upon the adhesive layer (31); a resin layer (33) covering the first conductive layer (32) excluding at least the first terminal sections (324T); and a second conductive layer (34) having second terminal sections (344T) and being provided upon the resin layer (33). The first terminal sections (324T) and the second terminal sections (344T) are mutually out of alignment along the thickness direction of the adhesive layer (31). The first terminal sections (324T) protrude towards the side away from the adhesive layer (31), in the thickness direction. When the first terminal sections (324T) are projected in a direction orthogonal to the thickness direction, at least part of the projected section of the first terminal sections (324T) overlaps the resin layer (33).

Inventors:
HONDO TAKAHARU (JP)
SHIOJIRI TAKESHI (JP)
Application Number:
PCT/JP2016/055893
Publication Date:
September 01, 2016
Filing Date:
February 26, 2016
Export Citation:
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Assignee:
FUJIKURA LTD (JP)
International Classes:
G06F3/044; G06F3/041; H05K1/02
Domestic Patent References:
WO2012132846A12012-10-04
Foreign References:
JP2012138017A2012-07-19
JP3191884U2014-07-17
JP2012088934A2012-05-10
JP2002229736A2002-08-16
JP2014106664A2014-06-09
JP2000020226A2000-01-21
JP2009199249A2009-09-03
Other References:
See also references of EP 3176683A4
Attorney, Agent or Firm:
TOKOSHIE PATENT FIRM (JP)
It can exceed and is a patent business corporation. (JP)
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