WIRING CIRCUIT BOARD, SEMICONDUCTOR DEVICE, WIRING CIRCUIT BOARD MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Title:

WIRING CIRCUIT BOARD, SEMICONDUCTOR DEVICE, WIRING CIRCUIT BOARD MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Document Type and Number:

WIPO Patent Application WO/2016/075863

Kind Code:

A1

Abstract:

Provided are: a wiring circuit board capable having sufficient reliability by dissipating heat by means of heat conduction, said heat having been generated along with driving of a semiconductor element, and by controlling a temperature increase of the semiconductor element within an allowable temperature; a semiconductor device; a wiring circuit board manufacturing method; and a semiconductor device manufacturing method. A wiring circuit board (100) is configured from: a base material (1) having a through hole; an insulating resin layer (7), which is laminated on the base material (1), and which has a conductive via (9) formed therein; and a wiring group (8) laminated on the insulating resin layer (7). A hollow through electrode (3) is formed by forming an inorganic adhesive layer (4a) in the through hole, and laminating a conductive layer (5a) on the inorganic adhesive layer (4a); the inside of the through electrode (3)is filled with a hole filling resin (14) having heat conductivity that is higher than that of the base material (1); and upper and lower ends of the through hole are covered with the conductive layer (5b).

Inventors:

IMAYOSHI KOJI

Application Number:

PCT/JP2015/005144

Publication Date:

May 19, 2016

Filing Date:

October 09, 2015

Export Citation:

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Assignee:

TOPPAN PRINTING CO LTD (JP)

International Classes:

H01L21/3205; H01L23/32; H01L21/768; H01L23/12; H01L23/15; H01L23/522; H05K1/11; H05K3/40; H05K3/46

Foreign References:

JP2013521663A	2013-06-10
JP2008205356A	2008-09-04
JP2012114400A	2012-06-14
JP2007059452A	2007-03-08

Other References: