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Patent Searching and Data


Title:
WIRING MODULE
Document Type and Number:
WIPO Patent Application WO/2022/264789
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a technology that can suppress the occurrence of loud sounds in a wiring module in which wiring members are held in a groove. This wiring module comprises a base member having a groove formed therein, wiring members accommodated in the groove, and a cover member that covers the open portion of the groove and keeps the wiring members from slipping out of the groove. The cover member includes a cover body for covering the open portion of the groove, a first extending part extending from the cover body on one side of the groove, and a second extending part extending from the cover body on another side of the groove. Inside the groove, the wiring members are disposed close to the one side of the groove. The cover body is provided with a projecting part dipping into the groove near the other side of the groove.

Inventors:
TOME YUTA (JP)
MIZUNO HOUSEI (JP)
Application Number:
PCT/JP2022/021874
Publication Date:
December 22, 2022
Filing Date:
May 30, 2022
Export Citation:
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Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
B60R13/02; B60J5/00; B60R16/02; H02G3/30
Domestic Patent References:
WO2018062014A12018-04-05
Foreign References:
JP2020083075A2020-06-04
JP2001136631A2001-05-18
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
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