Title:
WIRING MODULE
Document Type and Number:
WIPO Patent Application WO/2023/037889
Kind Code:
A1
Abstract:
A wiring module 20 comprises: an electric wire 30 which is provided with a core wire 31; an electric wire junction member 80 which is connected to the core wire 31; a bus bar 40 which is connected to electrode terminals 11A, 11B; and a circuit board 50 which is provided with a conduction path 52 including a first land 53 that is electrically connected to the bus bar 40 and a second land 54 that is connected to the electric wire junction member 80. The second land 54 is provided with a connection land part 55 and a mounting land part 56 which is provided separately from the connection land part 55. The electric wire junction member 80 is provided with a core wire connection part 81 which is connected to the core wire 31 and the connection land part 55 by first solder S1, and a mounting part 83 which is connected to the mounting land part 56 by second solder S2 that differs from the first solder S1.
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Inventors:
IKEDA SHUYA (JP)
NAKAYAMA OSAMU (JP)
MATSUMURA NOBUYUKI (JP)
NAKAYAMA OSAMU (JP)
MATSUMURA NOBUYUKI (JP)
Application Number:
PCT/JP2022/032065
Publication Date:
March 16, 2023
Filing Date:
August 25, 2022
Export Citation:
Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H01M50/569; H01M50/209; H01M50/249; H01M50/284; H01M50/298; H01M50/507
Domestic Patent References:
| WO2021124814A1 | 2021-06-24 |
Foreign References:
| JPH11120988A | 1999-04-30 | |||
| KR20170131899A | 2017-12-01 | |||
| JP2018097987A | 2018-06-21 |
Attorney, Agent or Firm:
AKATSUKI UNION PATENT FIRM (JP)
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