Title:
WIRING MODULE
Document Type and Number:
WIPO Patent Application WO/2023/210371
Kind Code:
A1
Abstract:
This wiring module 20, attached to a plurality of power storage elements 11, comprises a wire, a terminal 60 connected to the wire, and a circuit board 30, wherein: the terminal 60 comprises a connection part 63 connected to the circuit board 30; the circuit board 30 comprises a connection land to which the connection part 63 is soldered; the connection part 63 has a cut section 71 formed by cutting a metal plate material, and a pair of connection faces 70 which are disposed in a front-rear positional relationship and connected to each other via the cut section 71; and at least one of the pair of connection faces 70 and the front surface of the connection land cross and are continuously disposed.
Inventors:
IKEDA SHUYA (JP)
NAKAYAMA OSAMU (JP)
NAKAYAMA OSAMU (JP)
Application Number:
PCT/JP2023/014877
Publication Date:
November 02, 2023
Filing Date:
April 12, 2023
Export Citation:
Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H01M50/298; H01M50/249; H01M50/284; H01M50/507; H01M50/569
Domestic Patent References:
| WO2021084913A1 | 2021-05-06 |
Foreign References:
| JP2021536110A | 2021-12-23 | |||
| JP2009076224A | 2009-04-09 |
Attorney, Agent or Firm:
AKATSUKI UNION PATENT FIRM (JP)
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