Title:
WIRING-PANEL-EQUIPPED WIRE HARNESS
Document Type and Number:
WIPO Patent Application WO/2019/142384
Kind Code:
A1
Abstract:
The objective of the invention is to provide a wiring-panel-equipped wire harness having a novel structure that allows a wire harness to be produced and provided by using a small number of components and processing steps and that requires no wire harness wiring layout board device and no wire bundle tape winding operation. The invention comprises: a plurality of unbundled wires 24; a wiring panel 18 having the plurality of wires 24 routed on the surface 22 thereof; a plurality of wire fixing parts 26 provided so as to protrude at a plurality of locations on the surface 22 of the wiring panel 18, for positioning and holding the wires 24; and connectors 28, 30 provided at the ends of the plurality of wires 24 extending from the wire fixing parts 26. The plurality of wires 24 routed between the plurality of wire fixing parts 26 are in an unbundled state, whereas the wiring panel 18 has car-attachment parts 20.
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Inventors:
EBATA DAISUKE (JP)
YOKOI MOTOHIRO (JP)
IKEDA SHIGEKI (JP)
FUKAMI YUYA (JP)
TAKAKURA RYUTA (JP)
NISHIMURA TETSUYA (JP)
NAKANO HARUKA (JP)
ARAI KENTA (JP)
MIZUNO HOUSEI (JP)
YOKOI MOTOHIRO (JP)
IKEDA SHIGEKI (JP)
FUKAMI YUYA (JP)
TAKAKURA RYUTA (JP)
NISHIMURA TETSUYA (JP)
NAKANO HARUKA (JP)
ARAI KENTA (JP)
MIZUNO HOUSEI (JP)
Application Number:
PCT/JP2018/031167
Publication Date:
July 25, 2019
Filing Date:
August 23, 2018
Export Citation:
Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H01B7/00; B60R16/02; H01B13/012
Foreign References:
| JP2016171032A | 2016-09-23 | |||
| JP2003237498A | 2003-08-27 | |||
| JP2014069605A | 2014-04-21 | |||
| JP2007076622A | 2007-03-29 |
Attorney, Agent or Firm:
KASAI & NAKANE INTERNATIONAL PATENT FIRM et al. (JP)
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