Title:
WIRING PATTERN MANUFACTURING METHOD, TRANSISTOR MANUFACTURING METHOD, AND TRANSFER MEMBER
Document Type and Number:
WIPO Patent Application WO/2016/204207
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a new method as a technology replacing the conventional technology for obtaining a thin film with a wiring pattern.
The method for manufacturing a wiring pattern according to the present invention is characterized by being provided with: a laminate forming step of forming a laminate by bringing a first member having a resist layer and a metal layer formed on the resist layer, and a second member having a substrate into contact with each other; a resist layer patterning step of patterning the resist layer; and an etching step of selectively removing the metal layer.
Inventors:
NAKAZUMI MAKOTO (JP)
NISHI YASUTAKA (JP)
NARA KEI (JP)
NISHI YASUTAKA (JP)
NARA KEI (JP)
Application Number:
PCT/JP2016/067870
Publication Date:
December 22, 2016
Filing Date:
June 16, 2016
Export Citation:
Assignee:
NIKON CORP (JP)
International Classes:
H01L21/28; H01L21/336; H01L29/417; H01L29/786
Foreign References:
| JP2009130327A | 2009-06-11 | |||
| JP2006073794A | 2006-03-16 | |||
| JP2007115805A | 2007-05-10 | |||
| JPH0682825A | 1994-03-25 | |||
| JPH0547701A | 1993-02-26 |
Attorney, Agent or Firm:
Shoyo Intellectual Property Firm (JP)
Patent business corporation SHOYO Intellectual Property Firm (JP)
Patent business corporation SHOYO Intellectual Property Firm (JP)
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