Title:
WIRING STRUCTURE, METHOD FOR PRODUCING SAME, AND IMAGING DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/014400
Kind Code:
A1
Abstract:
The present invention provides a wiring structure which is suitable for reduction of the wiring capacitance. This semiconductor device comprises: a wiring layer which comprises a plurality of wiring lines that extend in a first direction; a first insulating film which is superposed on the wiring layer and comprises a void that is present in a gap region which is sandwiched between a plurality of wiring lines that are adjacent to each other in a second direction; and a second insulating film which is arranged between a plurality of wiring lines and the first insulating film. Each wiring line comprises: a metal film which is formed of a conductive material that contains a first metal; and a barrier metal layer which partially covers the periphery of the metal film in a cross-section that is perpendicular to the first direction, while being formed of a material containing a second metal that suppresses diffusion of the first metal. The second insulating film is arranged so as to cover a part of the metal film, and contains an insulating material that suppresses diffusion of the first metal.
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Inventors:
SEJIMA KOICHI (JP)
FUKATANI TAKASHI (JP)
NISHIO KENYA (JP)
HANEDA MASAKI (JP)
FUJII NOBUTOSHI (JP)
SAITO SUGURU (JP)
FUKATANI TAKASHI (JP)
NISHIO KENYA (JP)
HANEDA MASAKI (JP)
FUJII NOBUTOSHI (JP)
SAITO SUGURU (JP)
Application Number:
PCT/JP2021/025405
Publication Date:
January 20, 2022
Filing Date:
July 06, 2021
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L21/82; H01L21/3205; H01L21/768; H01L21/822; H01L21/8234; H01L23/522; H01L23/532; H01L27/00; H01L27/04; H01L27/06; H01L27/088; H01L27/146; H04N5/369
Domestic Patent References:
| WO2018186197A1 | 2018-10-11 |
Foreign References:
| JP2009188250A | 2009-08-20 | |||
| JP2009290240A | 2009-12-10 | |||
| JP2018507546A | 2018-03-15 | |||
| US10438843B1 | 2019-10-08 |
Attorney, Agent or Firm:
TSUBASA PATENT PROFESSIONAL CORPORATION (JP)
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