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Title:
WIRING SUBSTRATE, MANUFACTURING METHOD THEREOF, AND RESIN BODY SURFACE TREATMENT METHOD
Document Type and Number:
WIPO Patent Application WO/2006/093272
Kind Code:
A1
Abstract:
A wiring substrate includes a resin insulation layer (2) having a main surface and a wiring layer (12) arranged in contact with the main surface. The region of the main surface in contact with the wiring layer (12) has a surface roughness Ra not greater than 1.0 μm. Preferably, the region of the main surface in contact with the wiring layer (12) has a surface roughness Ra not greater than 0.3 μm. Preferably, the wiring substrate includes a core substrate (1) and the resin insulation layer (2) is arranged so as to cover the surface of the core substrate (1).

Inventors:
HIRAYAMA KATSURO (JP)
Application Number:
PCT/JP2006/304103
Publication Date:
September 08, 2006
Filing Date:
March 03, 2006
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
HIRAYAMA KATSURO (JP)
International Classes:
H05K3/38; H05K3/06; H05K3/18; H05K3/46
Foreign References:
JP2000036659A2000-02-02
JPH08288643A1996-11-01
JPH04212496A1992-08-04
JPH08259714A1996-10-08
JPH10190216A1998-07-21
Attorney, Agent or Firm:
Fukami, Hisao (Nakanoshima Central Tower 22nd Floor, 2-7, Nakanoshima 2-chome, Kita-k, Osaka-shi Osaka 05, JP)
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