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Title:
WIRING SUBSTRATE AND WIRING SUBSTRATE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/123977
Kind Code:
A1
Abstract:
A wiring substrate 1 comprises: a support 10 including at least one woven fabric 11 that is woven using weaving yarns 12, 13, which are respectively constituted by bundling insulating fibers 121, 131; and a conductor 20 supported by the support 10. The conductor 20 includes a first conduction path 21 that is provided to a first main surface 101 of the support 10 and that extends in the plane direction of the first main surface 101. The first conduction path 21 includes at least one of a first conductor section 211 that exists in a basket hole 14 of the woven fabric 11, and a first intermediate section 212 that exists in a gap between the insulating fibers 121, 131.

Inventors:
KAIZU MASAHIRO (JP)
Application Number:
PCT/JP2017/046441
Publication Date:
July 05, 2018
Filing Date:
December 25, 2017
Export Citation:
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Assignee:
FUJIKURA LTD (JP)
International Classes:
H05K3/10; H05K1/02
Domestic Patent References:
WO2006093016A12006-09-08
WO2016111133A12016-07-14
Foreign References:
JPS6151893A1986-03-14
JPS60200590A1985-10-11
JP2001024081A2001-01-26
JPH10321989A1998-12-04
JP2010028104A2010-02-04
JP2016256642A2016-12-28
JP2011014742A2011-01-20
JP2015046226A2015-03-12
Other References:
See also references of EP 3565390A4
Attorney, Agent or Firm:
TOKOSHIE PATENT FIRM (JP)
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